AMS utilizes Surface Mount as well as Mixed Technology equipment from manufacturers such as Panasonic, Fuji, Quad, Asymtek, MPM, Electrovert, CalTex, and CRT, among others.

Printed circuit board assemblies (PCBAs) :: Mechanical and Electromechanical assemblies ::  Box-level assemblies  >> Supporting  newest SMT Technologies such as BGA, COB, LGA, QFN, DFN.  >> Supporting legacy technologies such as pin-through-hole, and HMP assembly.

Continual capital equipment investment for ongoing support of most any board configuration or client opportunity, now and in the future.

• 50,000sf of manufacturing and production space (+20,000sf additional flex space capacity)
• 4  high speed surface mount lines
• Pick and Place Equipment with up to 40,000 placements per hour
• 8 Zone, Nitrogen Atmosphere Oven, 14 ft. temperature re-flow zone
• Wave Solder/PTH capable in both factories
• Custom High Temperature soldering, SMT and PTH.
• Epoxy, Urethane and other production adhesive use
• High density/Accuracy SMT placements: 42mm Camera
• 2 Solder Paste Height Measurement Systems
• X-Ray and BGA rework

• Genrad In Circuit Test
• Temperature Cycling Capabilities utilizing Hot and Cold Chamber
• Automated Visual Inspection, Optical Comparator
• 15 Microscopes from 10X to 300X, including Mantis Systems
• Funtional Test utililizing wide variety of owned equipment including Logic Analyzers
• SPEA high-speed Flying Probe Tester